Sawatec Systems

Duo Series: Perfect Couple

The SAWATEC combined systems connect spin modules or developers with the hotplate series in one compact cabinet. The duo series is convincing due to its robust design and flexible combination possibilities of the high-quality SAWATEC instruments, even for different substrate sizes. The combined systems are particular suitable for laboratories, R & D, institutes and pilot projects and are available as space saving mobile cabinet units.

SM-150/HP-150

SM-200/HP-200

SMD-200/HP-200

SM-150/HP-150 duo

The SM-150/HP-150 duo combines a spin module with a hotplate in a compact cabinet. The SM-150 spin module is ideal for manual and semi-automatic coating of thin films on substrates with minimal or no surface structure. It supports homogeneous coating of commercially available photoresists and coating materials on wafers up to 150 mm (6 inches) or 127 x 127 mm (5″ x 5″) substrates, with a process chamber designed for diameters up to 176 mm.

The HP-150 hotplate is specifically designed for soft-bake and hard-bake processes in lithography, MEMS, and similar applications. It offers a temperature range of up to 250°C, ensuring precise temperature control for high-quality coatings. The HP-150 hotplate accommodates substrates up to 150 mm (6 inches) in diameter or 127 x 127 mm (5 x 5 inches) and thicknesses up to 5 mm.

The SM-150/HP-150 duo can be customized with two HP-150 hotplates or one hotplate suitable for larger substrates (up to 300 mm), providing flexibility to meet different process requirements.

Spin Module SM-150

 

FEATURES (BASIC CONFIGURATION)

 

  1. Up to 50 programmes with 24 segments each can be programmed
  2. Quick start function for repeat processes
  3. User-friendly process configuration with touch screen panel
  4. Process parameters: speed, acceleration, time
  5. Rotational direction can be selected (CW, CCW)
  6. Manual loading and unloading of the substrates
  7. Substrate fixation via vacuum and safety interlock protection
  8. Manual cover with air flow inlet and sensor lock control
  9. Acoustic signal when the process has finished

ADDITIONAL FUNCTIONS (OPTIONS)

 

  1. Semi-automatic cartridge dispensing system, 50 ml glass syringe with manual dispensing arm and recirculation function
  2. Manual nitrogen (N2) purge of the process chamber
  3. Start/stop foot switch for ease of operation (cable
    length 1.8 m)
  4. Bowl assembly made of anodised aluminium
  5. Bowl protector made of aluminium or PE
  6. Vacuum pump for SM-150 module
  7. Wafer alignment tool 2 – 6” (round)
 

Hotplate HP-150

 

FEATURES (BASIC CONFIGURATION)

 

  1. Temperature control with digital target and actual value display
  2. Automatic temperature limit switch, no overheating
  3. Hotplate with safety glass, easy cleaning
  4. Easy levelling of the hotplate, prevents discharge of photoresist
  5. Manual substrate fixation via vacuum
  6. Manual loading and unloading of the substrates

ADDITIONAL FUNCTIONS (OPTIONS)

 

  1. N2 flushing manually controlled, no oxidation
  2. Simple setup tool for optimal alignment of the hotplate

Spin Module SM-150

 

  1. Speed range: 0 to 10’000 rpm +/-1 rpm
  2. Speed acceleration: 0 – 8’000 rpm in 0,8 sec. / 0 – 10’000 rpm in 1 sec. 1)
  3. Delay: 10’000 rpm – 0 in 2,5 sec. / 8’000 rpm – 0 in 0,8 sec. 1)
  4. Process time up to 2376 seconds
  5. Dosing time 99 seconds/segment

1) Depending on the substrate size and spin chuck type

Hotplate HP-150

 

  1. Temperature range: ambient temperature up to 250°C
  2. Temperature accuracy: +/- 1°C at 100°C

For more details or the documentation please contact our Sales Team via contact form

Perfect couple for coating and baking

The SAWATEC combined system SM-200/HP-200 duo connects a Spin Module with a hotplate in one compact cabinet.

The Spin Modules SM-200 are the optimal choice for semi-automatic coating of thin layers. The Round-Closed Chamber Technology (RCCT) system effectively reduces air turbulence over the rotating substrate and improves coating uniformity by saturating the atmosphere with solvents faster in the closed chamber. This results in slower drying of the photoresist and a more homogeneous coating process with remarkable savings in consumed media.

The Hotplate HP-200 was developed for precise soft bake and hard bake processes in lithography, in MEMS and similar applications. The temperature range is designed for up to 250 °C by default. The set temperature and the temperature profile have narrow margins, meaning that a high coating quality can be achieved. The HP series is convincing due to its high level of uniformity and the high-precision process repeatability. It can be used for substrates with a diameter of up to 200 mm and thicknesses of 14 mm at maximum (proximity/loading pins in the upper start position).

Spin Module SM-200

 

FEATURES (BASIC CONFIGURATION)

 

  1. Up to 50 programmes with 24 segments each can be programmed
  2. Quick start/stop function for repeat processes
  3. User-friendly process configuration with touch screen
  4. Process parameters: spin speed, segment time, dosing functions
  5. Rotational direction can be selected (CW, CCW)
  6. Dynamic dosing arm for up to 4 media lines
  7. Manual loading and unloading of the substrates
  8. Substrate fixation via vacuum incl. vacuum guard
  9. Acoustic signal after the end of the process

ADDITIONAL FUNCTIONS (OPTIONS)

 

  1. Additional dosing lines
  2. Automatic cartridge dosing system, 50 ml glass cartridge
  3. Top side edge bead removal (EBR circular and linear)
  4. Backside rinse of substrates to remove any backside edge contamination
  5. Automatic needle cleaning
  6. Program controlled Filter Fan Unit (FFU)
  7. Bowl protection insert for easy and efficient cleaning
  8. Wafer alignment tool 1 – 12“ (round)

Hotplate HP-200

 

FEATURES (BASIC CONFIGURATION)

 

  1. Temperature control with digital target and actual value display
  2. User-friendly process configuration with touch screen
  3. Quick start/stop function for repeat processes
  4. Automatic temperature limit switch, no overheating
  5. Heating ramp up possible with 24 program steps
  6. Proximity/loading pins, can be easily adapted to different substrate sizes
  7. Hot-plate with protection glass, easy cleaning
  8. Easy levelling of the hot-plate, prevents discharge of photoresist
  9. Manual substrate fixation via vacuum
  10. Manual loading and unloading of the substrates

ADDITIONAL FUNCTIONS (OPTIONS)

 

  1. N2 flushing program controlled, no oxidation
  2. HMDS priming program controlled, optimized adhesion
  3. Setup tool for optimal height adjustment of the pins and leveling of the Hotplate

Spin Module SM-200

 

  1. Speed range: 1 to 6’000 rpm +/-1 rpm
  2. Difference from set rotation speed to actual value < +/-1 %
  3. Speed acceleration: 0 – 6’000 rpm in min. 1 sec. (chuck size ≤ 150 mm)
  4. Process time up to 7’200 seconds with 0,1 sec. steps
  5. Time controlled dosage

Hotplate HP-200

 

  1. Temperature range: ambient temperature up to 250 °C
  2. Temperature accuracy: +/- 0.6 °C at 100 °C
  3. Electrical driven proximity and loading pins (stroke 8 mm)
  4. Program controlled adjustable proximity pins (0.1 mm increments)
  5. Pin-circle-diameters: 45 – 192 mm (2 – 8“)

For more details or the documentation please contact our Sales Team via contact form

Perfect couple for developing and baking

The combined systems SMD-200/HP-200 duo or SMD-200-E/HP-200 duo connect a Spin Developer with a Hotplate in one compact cabinet. These duo instruments are designed to clean, to develop or etch and bake wafers up to 8″” (200 mm) or substrates up to 6 x 6″” (150 x 150 mm).

The SMD developers by SAWATEC are convincing due to their high process performance, low chemical consumption as well as reliable repeatability, even with thick photoresist layers. Due to the user-friendly operation and easy cleaning, these instruments are ideally suited for laboratories, R&D, institutes and pilot projects.

The SAWATEC developers can be used for puddle or spray development, in which the optimum process being chosen based on application-technical and economic criteria. The advantage of the spray development compared to the puddle development is that very small fine structures can be released. The benefit of the puddle method is that significantly less developer solution is needed and better results are achieved when the substrate has deeper structures.

The Hotplate HP-200 was developed for precise soft bake and hard bake processes in lithography, in MEMS and similar applications. The temperature range is designed for up to 250 °C by default. The set temperature and the temperature profile have narrow margins, meaning that a high coating quality can be achieved. The HP series is convincing due to its high level of uniformity and the high-precision process repeatability. It can be used for substrates with a diameter of up to 200 mm and thicknesses of 14 mm at maximum (proximity/loading pins in the upper start position).

Developer SMD-200 / SMD-200-E

 

FEATURES (BASIC CONFIGURATION)

 

  1. Up to 50 programmes with 24 segments each can be programmed
  2. Quick start function for repeat processes
  3. User-friendly process configuration with touch screen
  4. Process param.: spin speed, segment time, speed and height of the spray arm
  5. Developer line and media tank (2 litre) for one developer included
  6. Nozzles in the process bowl for the backside rinse
  7. Manual loading and unloading of the substrates
  8. Mechanical substrate fixation
  9. Acoustic signal after the end of the process

ADDITIONAL FUNCTIONS (OPTIONS)

 

  1. Additional developer lines (up to 4 developer lines possible)
  2. Separation unit for media exhaust (tank and facility)
  3. Media inline heating system
  4. Spray nozzle made of PEEK or stainless steel (0,3 / 0,5 mm)
  5. Various sizes of Spin Chucks are available

Hotplate HP-200

 

FEATURES (BASIC CONFIGURATION)

 

  1. Temperature control with digital target and actual value display
  2. User-friendly process configuration with touch screen
  3. Quick start/stop function for repeat processes
  4. Automatic temperature limit switch, no overheating
  5. Heating ramp up possible with 24 program steps
  6. Proximity/loading pins, can be easily adapted to different substrate sizes
  7. Hot-plate with protection glass, easy cleaning
  8. Easy levelling of the hot-plate, prevents discharge of photoresist
  9. Manual substrate fixation via vacuum
  10. Manual loading and unloading of the substrates

ADDITIONAL FUNCTIONS (OPTIONS)

 

  1. N2 flushing program controlled, no oxidation
  2. HMDS priming program controlled, optimized adhesion
  3. Setup tool for optimal height adjustment of the pins and leveling of the Hotplate

Developer SMD-200 / SMD-200-E

 

  1. Speed range: 0 to 3’000 rpm +/-1 rpm 1)
  2. Speed acceleration: 0 to 3’000 rpm in 0.3 seconds 1)
  3. Speed of the spray arm 10 to 100 mm/second
  4. Rinse and N2 drying 180 seconds/segment
  5. Heatable process hood up to 50 °C
  6. Spray nozzle made of PEEK (SMD-200) or stainless steel (SMD-200-E): 0.8 mm

1) Slower speed and acceleration for the process recommended

Hotplate HP-200

 

  1. Temperature range: ambient temperature up to 250 °C
  2. Temperature accuracy: +/- 0.6 °C at 100 °C
  3. Electrical driven proximity and loading pins (stroke 8 mm)
  4. Program controlled adjustable proximity pins (0.1 mm increments)
  5. Pin-circle-diameters: 45 – 192 mm (2 – 8“)

For more details or the documentation please contact our Sales Team via contact form

Flexible Automation

SAWATEC cluster systems offer a comprehensive solution for customers seeking fully automatic cassette-to-cassette applications. The modular CS series consists of an optical prealigner station and three versatile stations that can be equipped with various process-oriented instruments. SAWATEC has designed configurations tailored to standard process steps, ensuring optimal performance and efficiency.

With its modular and flexible design, including an automatic central load station, the cluster system enables customers to implement customized solutions that meet their specific production needs. This flexibility allows for individualization and optimization of the production process, making the cluster system an ideal choice for customers seeking tailored and efficient solutions in their manufacturing operations, as part of the Challenger series.

ROBO module

ROBO module

The SAWATEC Robo-Module offers a versatile solution by combining a hotplate with a spin module, a spray coater, or a developer, depending on the desired combination. These flexible systems are designed to provide seamless integration of robot modules with modern process instruments. The models can be operated in both manual and automatic modes, offering flexibility in the workflow.

With their highly adaptable module configurations, these customized systems are suitable for handling wafers up to 12 inches in size. They provide efficient and reliable solutions for various process requirements, ensuring high-quality results in substrate processing and enabling streamlined operations.

FEATURES (BASIC CONFIGURATION)

 

  1. Flexible design to combine robot module with advanced process instruments
  2. All modules can be operated in the manual or in the automatic mode
  3. Customized systems with highly flexible module configurations
  4. Reliable process instruments, service-friendly and low downtime
  5. Handling wafers from 3, 4, 6, 8 up to 12 inches
  6. Central positioned 6-axis cleanroom approved robot with endeffector
  7. Mechanical pre-alignment station
  8. Carrier station (max. 2 carriers) with customized design adaption for different cassette types
  9. Programming PolyScope graphical user interface on one 12″ touch screen with mounting device
  10. Compact design and minimized space requirements, easy to clean

ADDITIONAL FUNCTIONS (OPTIONS)

 

  1. Also available with up to three hotplates

PERFORMANCE DATA

  • Handling wafers from 3″, 4″, 6″, 8″ up to 12″

For more details or the documentation please contact our Sales Team via contact form

CS Series: Modular System

The SAWATEC cluster systems are the perfect solution for customers looking for fully automatic cassette-to-cassette applications. The modular CS series is comprised of an optical prealigner station and three flexible stations, which can be equipped with a number of process-oriented instruments. SAWATEC has developed appropriate configurations for standard process steps. Due to its modular, flexible design with an automatic central load station, the cluster system allows the customer to implement individual, customer- specific solutions in the production (Challenger series).

Sirius

Pioneer

Explorer

Orbiter

CS-200-4 sirius

The CS-200-4 Sirius cluster system consists of three stations. The first station is equipped with a spin module SM-200-CS, providing efficient thin layer coating. The second station offers the option of using a developer, either SMD-200-CS for standard development or SMD-200-E-CS for etching processes. In the third station, there are three stacked hotplates and one coolplate for precise temperature control.

Depending on the specific process flow and capacity requirements, additional hotplates can be integrated into the system. This flexibility allows for customization and scalability to meet the needs of various applications. The CS-200-4 Sirius cluster system enables efficient and automated cassette-to-cassette processing, making it an ideal choice for customers seeking a comprehensive and adaptable solution.

FEATURES (BASIC CONFIGURATION)

  1. High flexibility and productivity, quick amortisation
  2. Advanced process instruments for high uniformity
  3. Flexible process module configurations
  4. Automatic wafer detection in the cassette
  5. Compact design and minimized space requirements
  6. Easy to control with 15” touch screen panel
  7. Linux operating system
  8. Optical operating status display of each process module
  9. Free programmable cluster process
  10. Two carriers can be processed at the same time with different substrate sizes
  11. All process modules can be operated in the manual, the automatic or in the cluster mode
  12. Each process module can be operated in the cluster process or as a single module
  13. Access via Ethernet connection for remote diagnostics and maintenance
  14. Secure data transfer with mbNET module and VPN connection
  15. USB connection for onsite software uploads/updates and process data export/import
  16. Each process module is freely accessible and easy to clean
  17. Service-friendly, low downtime and maintenance cost

FEATURES (BASIC CONFIGURATION)

 

  • Substrate sizes: 3”, 4”, 6” up to max. 8” (A maximum of 3 different successive substrate sizes can be processed, 3, 4, 6” or 4, 6, 8”)

For more details or the documentation please contact our Sales Team via contact form

CS-200-4 pioneer

The CS-200-4 Pioneer cluster system features three stations designed for specific process steps. In the first station, there is an iSPRAY-200-CS spray coater, enabling efficient and homogeneous spray coating of substrates. The second station offers the option of using a developer, with the choice between SMD-200-CS for standard development or SMD-200-E-CS for etching processes. The third station comprises three stacked hotplates and one coolplate, providing precise temperature control.

For processes requiring additional hotplates, the CS-200-4 Pioneer cluster system allows for integration based on the specific process flow and capacity requirements. This modular approach ensures flexibility and scalability to meet the needs of diverse applications. With its comprehensive range of capabilities, the CS-200-4 Pioneer cluster system offers an advanced solution for fully automated cassette-to-cassette processing.

FEATURES (BASIC CONFIGURATION)

  1. High flexibility and productivity, thus fast amortization
  2. Modern process instruments for high uniformity
  3. Flexible process module configurations
  4. Automatic wafer detection in the cassette
  5. Compact design and minimal space requirements
  6. Easy control via 15″ touch screen panel
  7. Linux operating system
  8. Optical operating status display of the individual process modules
  9. Freely programmable cluster process
  10. Two carriers can be processed simultaneously with different substrate sizes
  11. All process modules can be operated in manual, automatic or cluster mode
  12. Each process module can be operated in cluster process or as individual module
  13. Access via Ethernet connection for remote diagnostics and maintenance possible
  14. Secure data transmission with mbNET module and VPN connection
  15. USB connection for software uploads/updates and process data export/import on site
  16. Each process module is freely accessible and easy to clean
  17. Service friendly, low downtime and maintenance costs

FEATURES (BASIC CONFIGURATION)

  • Substrate sizes: 3″, 4″, 6″ up to max. 8″ (A maximum of 3 different consecutive substrate sizes can be processed, 3, 4, 6″ or 4, 6, 8″)

For more details or the documentation please contact our Sales Team via contact form

CS-300-4 explorer

The CS-300-4 Explorer cluster system comprises a spin module SM-300-CS in the first station, a developer SMD-300-CS or SMD-300-E-CS (for etching) in the second station, and three stacked hotplates with one coolplate in the third station.

Additional hotplates can be integrated based on process flow and capacity requirements. The CS-300-4 Explorer cluster system offers a modular and flexible solution for fully automated cassette-to-cassette applications, enabling efficient and precise processing in various manufacturing environments.

FEATURES (BASIC CONFIGURATION)

  1. High flexibility and productivity, quick amortisation
  2. Advanced process instruments for high uniformity
  3. Flexible process module configurations
  4. Automatic wafer detection in the cassette
  5. Compact design and minimized space requirements
  6. Easy to control with 15” touch screen panel
  7. Linux operating system
  8. Optical operating status display of each process module
  9. Free programmable cluster process
  10. Two carriers can be processed at the same time with different substrate sizes
  11. All process modules can be operated in the manual, the automatic or in the cluster mode
  12. Each process module can be operated in the cluster process or as a single module
  13. Access via Ethernet connection for remote diagnostics and maintenance
  14. Secure data transfer with mbNET module and VPN connection
  15. USB connection for onsite software uploads/updates and process data export/import
  16. Each process module is freely accessible and easy to clean
  17. Service-friendly, low downtime and maintenance cost

FEATURES (BASIC CONFIGURATION)

  • Substrate sizes: 6”, 8” up to max. 12”

For more details or the documentation please contact our Sales Team via contact form

CS-300-4 orbiter

The cluster system CS-300-4 orbiter is in the first station with a spray coater iSPRAY-300-CS, in the second station with a developer SMD-300-CS or SMD-300-E-CS (etching) and in the third station with 3 stacked hotplates and one coolplate equipped. Depending on the process flow and capacity requirements more hotplates can be integrated.

FEATURES (BASIC CONFIGURATION)

  1. High flexibility and productivity, thus fast amortization
  2. Modern process instruments for high uniformity
  3. Flexible process module configurations
  4. Automatic wafer detection in the cassette
  5. Compact design and minimal space requirements
  6. Easy control via 15″ touch screen panel
  7. Linux operating system
  8. Optical operating status display of the individual process modules
  9. Freely programmable cluster process
  10. Two carriers can be processed simultaneously with different substrate sizes
  11. All process modules can be operated in manual, automatic or cluster mode
  12. Each process module can be operated in cluster process or as individual module
  13. Access via Ethernet connection for remote diagnostics and maintenance possible
  14. Secure data transmission with mbNET module and VPN connection
  15. USB connection for software uploads/updates and process data export/import on site
  16. Each process module is freely accessible and easy to clean
  17. Service friendly, low downtime and maintenance costs

FEATURES (BASIC CONFIGURATION)

  • Substrate sizes: 6”, 8” up to max. 12”

For more details or the documentation please contact our Sales Team via contact form