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HP Series: Easy To Bake

The HP series is convincing due to its high level of uniformity and the high-precision process repeatability. It can be used for substrates with a diameter of up to 900 mm and thicknesses of 14 mm at maximum (proximity/loading pins in the upper start position).

The hot-plate is covered with protection glass, which makes cleaning easier. Due to the high quality, robust design and easy handling, SAWATEC Hotplates are preferentially used in laboratories, R & D and small-scale production.

HP-150

HP-200

HP-300

HP-600

High precision soft and hard baking

The Hotplate HP-200 was developed for precise soft bake and hard bake processes in lithography, in MEMS and similar applications. It can be used for substrates with a diameter of up to 200 mm and thicknesses of 14 mm at maximum (proximity/loading pins in the upper start position). The temperature range is designed for up to 250 °C by default. The set temperature and the temperature profile have narrow margins, meaning that a high coating quality can be achieved.

The high-precision instruments are available as mobile cabinet, portable bench-top and bench-mounted unit.

FEATURES (BASIC CONFIGURATION)

 

  1. Temperature control with digital target and actual value display
  2. User-friendly process configuration with touch screen
  3. Quick start/stop function for repeat processes
  4. Automatic temperature limit switch, no overheating
  5. Heating ramp up possible with 24 program steps
  6. Proximity/loading pins, can be easily adapted to different substrate sizes
  7. Hot-plate with protection glass, easy cleaning
  8. Easy levelling of the hot-plate, prevents discharge of photoresist
  9. Manual substrate fixation via vacuum
  10. Manual loading and unloading of the substrates

ADDITIONAL FUNCTIONS (OPTIONS)

 

  1. N2 flushing program controlled, no oxidation
  2. HMDS priming program controlled, optimized adhesion
  3. Setup tool for optimal height adjustment of the pins and leveling of the Hotplate”

PERFORMANCE DATA

  • Temperature range: ambient temperature up to 250 °C
  • Temperature accuracy: +/- 0.6 °C at 100 °C
  • Electrical driven proximity and loading pins (stroke 8 mm)
  • Program controlled adjustable proximity pins (0.1 mm increments)
  • Pin-circle-diameters: 45 – 192 mm (2 – 8″”)

For more details or the documentation please contact our Sales Team via contact form

Ultra-high precision soft and hard baking

The Hotplate HP-200-Z was developed for ultra-high precise soft bake and hard bake processes in lithography, in MEMS and similar applications. The temperature range is designed for up to 300 °C by default. The set temperature and the temperature profile have narrow margins, meaning that a high coating quality can be achieved.

The multi-zone heating system ensures very high temperature distribution, which is adjustable for each zone. The hotplate also has a vacuum chamber and can be used as standard for bonding agent applications.

The ultra-high precision instruments are available as mobile cabinet and bench-mounted unit.

FEATURES (BASIC CONFIGURATION)

 

  1. Temperature control with digital target and actual value display
  2. User-friendly process configuration with touch screen
  3. Quick start/stop function for repeat processes
  4. Automatic temperature limit switch, no overheating
  5. Heating ramp up possible with 24 program steps
  6. Free programmable heating curve with max. 10 °C/min (25 – 300 °C)
  7. Free programmable cooling curve with max. 5 °C/min (300 – 40 °C)
  8. Hotplate with multi-zone heating (9 zones) and with protection glass for easy cleaning
  9. Easy levelling of the hotplate, prevents discharge of photoresist
  10. Manual substrate fixation via vacuum
  11. Manual loading and unloading of substrates
  12. N2 flushing program controlled, no oxidation
  13. HMDS priming program controlled, optimized adhesion

ADDITIONAL FUNCTIONS (OPTIONS)

 

  1. Setup tool for optimal leveling of the Hotplate
PERFORMANCE DATA
  • Temperature range: ambient temperature up to 300 °C
  • Temperature accuracy: +/- 0.3 °C at 100 °C

For more details or the documentation please contact our Sales Team via contact form

High precision soft and hard baking

The Hotplate HP-300 was developed for precise soft bake and hard bake processes in lithography, in MEMS and similar applications. It can be used for substrates with a diameter of up to 300 mm and thickness of 14 mm at maximum (proximity/loading pins in the upper start position). The temperature range is designed for up to 250 °C by default. The set temperature and the temperature profile have narrow margins, meaning that a high coating quality can be achieved.

The high-precision instruments are available as mobile cabinet and bench-mounted unit.

FEATURES (BASIC CONFIGURATION)

 

  1. Temperature control with digital target and actual value display
  2. User-friendly process configuration with touch screen
  3. Quick start/stop function for repeat processes
  4. Automatic temperature limit switch, no overheating
  5. Heating ramp up possible with 24 program steps
  6. Proximity as well as loading pins, can be easily adapted to different substrate sizes
  7. Hot-plate with protection glass, easy cleaning
  8. Easy levelling of the hot-plate, prevents discharge of photoresist
  9. Manual substrate fixation via vacuum
  10. Manual loading and unloading of the substrates

ADDITIONAL FUNCTIONS (OPTIONS)

 

  1. N2 flushing program controlled, no oxidation
  2. HMDS priming program controlled, optimized adhesion
  3. Setup tool for optimal height adjustment of the pins and leveling of the Hotplate
PERFORMANCE DATA
  • Temperature range: ambient temperature up to 250 °C
  • Temperature accuracy: +/- 0.8 °C at 100 °C
  • Electrical driven proximity and loading pins (stroke 8 mm)
  • Program controlled adjustable proximity pins (0.1 mm increments)
  • Pin-circle-diameters: 45 – 292 mm (2 – 12″”)

For more details or the documentation please contact our Sales Team via contact form

Short process time due to controlled cooling

At SAWATEC you can get different Coolplates for fast and controlled cooling of flat substrates. The Coolplate series shortens the process time when cooling the substrates or wafers. If required, the cooling rate can be increased with a chiller.

CP-200

Coolplate CP-200

The semi-automatic Coolplates impress with their high-quality design and easy handling. It can be used for substrates up to Ø 200 mm and thicknesses up to 14 mm or with wafers ranging in size from 50 x 50 to 200 x 200 mm, round or square.

Coolplates are available as mobile cabinet and bench-mounted unit.

FEATURES (BASIC CONFIGURATION)

 

  1. Digital temperature with actual value display
  2. User-friendly process configuration with touch screen
  3. Quick start/stop function for repeat processes
  4. Proximity/loading pins, can be easily adapted to different substrate sizes
  5. Manual substrate fixation via vacuum
  6. Manual loading and unloading of substrates

ADDITIONAL FUNCTIONS (OPTIONS)

 

  1. Setup tool for optimal height adjustment of the pins and leveling of the Coolplate
  2. Can be combined with a commercially available chiller for precise control of the cooling temperature or rather the cooling liquid.
PERFORMANCE DATA
  • Temperature range: 5 – 23 °C (temperature < 18 °C with chiller)
  • Electrical driven proximity/loading pins
  • Proximity adjustment from 0 – 1 mm (0.1 mm increments)
  • Substrate size: max. 200 mm (round or square)
  • Pin-circle-diameters: 45 – 192 mm (2 – 8“)

For more details or the documentation please contact our Sales Team via contact form

SM Series: Coating2

The SM series is convincing due to its high level of uniformity and repeatability, coupled with easy operation and comfortable handling. In order to keep the cleaning effort for the process chamber to a minimum, SAWATEC has developed a comprehensive and good value bowl protection insert. This bowl protector is easy to remove and dispose of once the process has been completed. Due to the high-quality design, the maintenance effort is minimal. Therefore, the SAWATEC Spin Modules are preferentially used in laboratories, R & D and small-scale production.

The Spin Modules are used for substrates with no or very low surface structures. All commercial photoresists and coating materials can be coated homogeneously on wafers up to 900 mm or 600 x 600 mm substrates.

SM-150

SM-200

SM-300

SM-600

SM-900

Ideal for manual coatings

The Spin Modules SM-150 are the optimal choice for manual coating of thin layers. They are used for substrates with no or very low surface structures. All commercial photoresists and coating materials can be coated homogeneously on wafers up to 150 mm (6 inches) or 127 x 127mm (5×5 inches) substrates. The process chamber is designed for a diameter of up to 176 mm.

The high-precision, good value instruments are available both as portable bench-top and bench mounted unit.

FEATURES (BASIC CONFIGURATION)

 

  1. Up to 50 programmes with 24 segments each can be programmed
  2. Quick start function for repeat processes
  3. User-friendly process configuration with touch screen
  4. Process parameters: spin speed, acceleration, segment time, dosing functions
  5. Rotational direction can be selected (CW, CCW)
  6. Manual loading and unloading of the substrates
  7. Substrate fixation via vacuum incl. vacuum guard
  8. Manual cover with air flow inlet and sensor lock control
  9. Acoustic signal after the end of the process

ADDITIONAL FUNCTIONS (OPTIONS)

 

  1. Semi-automatic cartridge dosing system, 50 ml glass cartridge with manual dispensing arm and suck back function
  2. Nitrogen (N2) purge of the process chamber to prevent oxidation
  3. Start/stop foot switch for ease of operation (cable length 1.8 m)
  4. Bowl assembly made of anodised aluminium or stainless steel
  5. Wafer alignment tool 1” – 12” (round)
  6. Bowl protection insert made of aluminium
  7. Vacuum pump


ADDITIONAL INFORMATION


SPIN CHUCK RANGE

For perfect coating results, the spin chucks are supplied in different sizes, materials and designs. Depending on the application, one-piece or twopiece spin chuck sets with optical centring aid are used. To ensure that the reverse side of the substrate does not become contaminated, it is crucial to select the optimal spin chuck size and specific chuck design. Replacing the spin chucks is very easy and does not require any tools.

PERFORMANCE DATA
  1. Speed range: 0 to 10’000 rpm +/-1 rpm
  2. Speed acceleration: 0 – 10’000 rpm in 1 sec.*
  3. Delay: 10’000 rpm – 0 in 2,5 sec.*
  4. Process time up to 7‘200 seconds
Depending on the substrate size and spin chuck type

For more details or the documentation please contact our Sales Team via contact form

Optimal choice for semi-automatic coatings

The Spin Module SM-200 is the optimal choice for semi-automatic coating of thin layers. All commercial photoresists and coating materials can be coated homogeneously on wafers up to 200 mm (8 inches) or 150 x 150 mm (6×6 inches) substrates.

The Round-Closed Chamber Technology (RCCT) system effectively reduces air turbulence over the rotating substrate and improves coating uniformity by saturating the atmosphere with solvents faster in the closed chamber. This results in slower drying of the photoresist and a more homogeneous coating process with remarkable savings in consumed media.

The high-precision instruments are available as mobile cabinet and bench-mounted unit.

FEATURES (BASIC CONFIGURATION)

 

  1. Up to 50 programmes with 24 segments each can be programmed
  2. Quick start/stop function for repeat processes
  3. User-friendly process configuration with touchscreen
  4. Process parameters: spin speed, segment time, dosing functions
  5. Rotational direction can be selected (CW, CCW)
  6. Dynamic dosing arm for up to 4 media lines
  7. Manual loading and unloading of the substrates
  8. Substrate fixation via vacuum incl. vacuum guard
  9. Acoustic signal after the end of the process

ADDITIONAL FUNCTIONS (OPTIONS)

 

  1. Additional dosing lines
  2. Automatic cartridge dosing system, 50 ml glass cartridge
  3. Top side edge bead removal (EBR circular and linear)
  4. Backside rinse of substrates to remove any backside edge contamination
  5. Automatic needle cleaning
  6. Program controlled Filter Fan Unit (FFU)
  7. Bowl protection insert for easy and efficient cleaning
  8. Wafer alignment tool 1 – 12″” (round)


SPIN CHUCK RANGE


The Spin Chuck range by SAWATEC offers an optimum selection for all substrate sizes and materials to switch seamlessly from one Spin Chuck size and design to the next. To ensure that the reverse side of the substrate does not become contaminated, it is crucial to select the optimum spin chuck size and specific chuck design. Replacing the spin chucks is very easy and does not require any tools. Depending on the application, one-piece or two-piece, vacuum or mechanical spin chucks with optical centring aid are used.

PERFORMANCE DATA
  • Speed range: 1 to 6’000 rpm +/-1 rpm (optional 10’000 rpm for wafers smaller than 8″)
  • Difference from set rotation speed to actual value < +/-1 %
  • Speed acceleration: 0 – 6’000 rpm in 0,8 sec.
  • Delay: 6’000 – 0 rpm in 0,8 sec.
  • Process time up to 7’200 seconds with 0,1 sec. steps
  • Dosing time depends on pump type

For more details or the documentation please contact our Sales Team via contact form

Optimal choice for semi-automatic coatings

The Spin Module SM-300 is the optimal choice for semi-automatic coating of thin layers. All commercial photoresists and coating materials can be coated homogeneously on wafers up to 300 mm (12 inches) or 200 x 200 mm (8 × 8 inches) substrates.

The Round-Closed Chamber Technology (RCCT) system effectively reduces air turbulence over the rotating substrate and improves coating uniformity by saturating the atmosphere with solvents faster in the closed chamber. This results in slower drying of the photoresist and a more homogeneous coating process with remarkable savings in consumed media.

The high-precision instruments are available both as mobile cabinet and bench-mounted units.

FEATURES (BASIC CONFIGURATION)

 

  1. Up to 50 programmes with 24 segments each can be programmed
  2. Quick start/stop function for repeat processes
  3. User-friendly process configuration with touch screen
  4. Process parameters: spin speed, segment time, dosing functions
  5. Rotational direction can be selected (CW, CCW)
  6. Dynamic dosing arm for up to 4 media lines
  7. Manual loading and unloading of the substrates
  8. Substrate fixation via vacuum incl. vacuum guard
  9. Acoustic signal after the end of the process

ADDITIONAL FUNCTIONS (OPTIONS)

 

  1. Additional dispensing lines
  2. Automatic cartridge dispensing system, 50 ml glass cartridge
  3. Top side edge bead removal (EBR circular and linear)
  4. Backside rinse of substrates to remove any backside edge contamination
  5. Automatic needle cleaning
  6. Program controlled Filter Fan Unit (FFU)
  7. Bowl protection insert for easy and efficient cleaning
  8. Wafer alignment tool 1 – 12″” (round)


SPIN CHUCK RANGE


The Spin Chuck range by SAWATEC offers an optimum selection for all substrate sizes and materials to switch seamlessly from one Spin Chuck size and design to the next. To ensure that the reverse side of the substrate does not become contaminated, it is crucial to select the optimum Spin Chuck size and specific Chuck design. Replacing the Spin Chucks is very easy and does not require any tools. Depending on the application, one-piece or two-piece, vacuum or mechanical spin chucks with optical centring aid are used.

PERFORMANCE DATA

  • Speed range: 1 to 6’000 rpm +/-1 rpm
  • Difference from set rotation speed to actual value < +/-1 %
  • Speed acceleration: 0 – 6’000 rpm in min. 1 sec. (chuck size ≥ 150 mm)
  • Process time up to 7’200 seconds with 0,1 sec. steps
  • Time controlled dosage

For more details or the documentation please contact our Sales Team via contact form

Hotplate HP-600

The SM-600 Spin Modules are the ideal solution for achieving semi-automatic coating of larger substrates. They enable the homogeneous coating of all commercially available photoresists and coating materials on wafers up to 600 mm or 16 × 16 inch substrates.

Featuring the innovative Round-Closed Chamber Technology (RCCT) system, these modules effectively minimize air turbulence over the rotating substrate. By rapidly saturating the atmosphere with solvents in the closed chamber, the RCCT system ensures slower drying of the photoresist, resulting in a more uniform and homogeneous coating process. Moreover, this technology enables remarkable savings in consumed media.

These high-precision instruments are available exclusively as mobile cabinet units, providing convenience and flexibility for various coating applications.

FEATURES (BASIC CONFIGURATION)

 

  1. Up to 50 programmes with 24 segments each can be programmed
  2. Quick start function for repeat processes
  3. User-friendly process configuration with touch screen panel
  4. Process parameters: speed, acceleration, time
  5. Rotational direction can be selected (CW, CCW)
  6. RCCT system (Round-Closed-Chamber-Technology)
  7. Dynamic dispense arm prepared for up to 4 media lines
  8. Dispensing pump SP-50 for viscosities up to 800 cps including suck-back function
  9. Manual loading and unloading of the substrates
  10. Substrate fixation via vacuum and safety interlock protection
  11. Acoustic signal when the process has finished

ADDITIONAL FUNCTIONS (OPTIONS)

 

  1. Automatic cartridge dispensing system CDS-50, 50 ml glass syringe
  2. Top side edge bead removal (EBR circular)
  3. Additional dispensing line including precision dosing pumps
  4. Start/stop foot switch for ease of operation (cable
    length 1.8 m)
  5. PR tank heating system (2 ltr.)

PERFORMANCE DATA

  • Speed range: 1 to 2’000 rpm +/-1 rpm
  • Difference from set rotation speed to actual value < +/-1 %
  • Speed acceleration: 0 – 5’000 rpm in 0.5 sec. (unloaded)
  • Delay: 5’000 rpm – 0 in 0,5 sec.
  • Process time up to 2’376 seconds per segment with 0.1 sec. steps
  • Dosing time 99 seconds/segment

For more details or the documentation please contact our Sales Team via contact form

Hotplate HP-900

The SM-900 Spin Modules are specifically designed for semi-automatic coating of larger substrates. These modules are suitable for substrates with no or very low surface structures. They enable the homogeneous coating of all commercially available photoresists and coating materials on wafers up to 900 mm or 600 x 600 mm (24 × 24″) substrates.

Equipped with a protection disk, these modules effectively reduce air turbulence over the rotating substrate. This feature significantly improves coating uniformity by quickly saturating the atmosphere within the closed process chamber with solvents. As a result, the resist dries more slowly, leading to a more uniform and homogeneous coating process. Additionally, this technology allows for remarkable savings in consumed media.

The SM-900 Spin Modules are high-precision instruments that are available exclusively as mobile cabinet units. This ensures their versatility and ease of use for various coating applications.

FEATURES (BASIC CONFIGURATION)

 

  1. Up to 50 programmes with 24 segments each can be programmed
  2. Quick start/stop function for repeat processes
  3. User-friendly process configuration with touch screen panel
  4. Process parameters: speed, acceleration, time
  5. Rotational direction can be selected (CW, CCW)
  6. Dynamic dispense arm prepared for up to 3 media lines
  7. Dispensing pump SP-50 for viscosities up to 800 cps including suck-back function
  8. Manual loading and unloading of the substrates
  9. Substrate fixation via vacuum and safety interlock protection
  10. Acoustic signal when the process has finished

ADDITIONAL FUNCTIONS (OPTIONS)

 

  1. Additional dispensing line including precision dosing pumps
  2. Top side edge bead removal (EBR circular)
  3. Automatic needle cleaning
  4. Start/stop foot switch for ease of operation
    (cable length 1.8 m)

PERFORMANCE DATA

  • Speed range: 1 to 2’000 rpm +/-1 rpm
  • Difference from set rotation speed to actual value < +/-1 %
  • Speed acceleration: max. 300 rad/s” (unloaded)
  • Process time up to 300 seconds per segment with 0.1 sec. steps

For more details or the documentation please contact our Sales Team via contact form

iSPRAY Series: 3D Microstructures

For substrates with a highly structured wafer topography, deep MEMS structures or a non-planar surface texture, the iSPRAY-300 by SAWATEC ensures that the coating is as homogeneous as possible. It is a high-precision spray coater for manual spray coating or spray development processes and it is used specifically in laboratories, R & D and small-scale production in MEMS fabrication.

iSPRAY-300

iSPRAY-300

In conjunction with low-viscosity photoresists (e.g. Shipley 1813, AZ 4999, AZ 9260, TI Spray etc.) that are particularly suited for spray coating, the process-optimised spray nozzle generates extremely fine droplets. Spray coating takes place by means of a loop-shaped spray pattern in a closed process chamber, thus ensuring uniform coating across the entire substrate surface and a high level of repeatability. The spray nozzle spacing, which can be adjusted as a function of the process, improves the distribution of the spray coating for specific topographies and increases coating versatility. Both round and square substrates, up to 8 wafers at a time, can be coated.

The iSPRAY-300 spray coater is designed for wafers with a maximum diameter of 300 mm or for 12 × 12 inch substrates. The high-precision instruments are available as mobile cabinet.

FEATURES (BASIC CONFIGURATION)

 

  1. Quick start function for repeat processes
  2. User-friendly process configuration with touch screen
  3. Process parameters: spray pattern, spray arm speed, distance of spray nozzle, spray beam cone (x- and y-axis direction), number of spray layers
  4. Electrically operated spray arm with selectable speed in the direction of the x-axis and the y-axis
  5. Automatic adjustment of the spray nozzle distance (z-lift)
  6. Adjustable spray nozzle with constant spray pressure and automatic cleaning function
  7. Manual loading and unloading of the substrates
  8. Acoustic signal after the end of the process

ADDITIONAL FUNCTIONS (OPTIONS)

  1. Various spray nozzles Micro 3/3, 3/4, 3/5
  2. Heatable chuck up to 150° C, usable heating surface Ø 300 mm
  3. Second spray nozzle with separate photoresist feeds to prevent contamination
  4. Program controlled Filter Fan Unit (FFU)


ACCESSORIES

Additionally, the iSPRAY-300 can be equipped with a heatable chuck. With this, even photoresists with a higher viscosity can be processed with little accumulation in cavities and reliable coating of the edges.

PERFORMANCE DATA

  • Spray volume: 50 cl in buffer cartridge, supply pump with level control
  • Viscosity of the spray medium: 0.3 to 25 cSt (μPas)
  • Spray nozzle: droplet size < 7 micron, type Micro 3
  • Speed and position accuracy of the spray arm: max. 200 mm/s; ±0.1 mm
  • Number of spray cycles: max. 20 meanders

For more details or the documentation please contact our Sales Team via contact form

SMD series: Highly Efficient

The development of the exposed photoresist is one of the most critical process steps, therefore special care needs to be given to the selection of the development process and its parameters (developer mixing ratio, development time, etc.). Each substrate is individually developed respectively etched in the spray development and the exposed areas are continuously sprayed with fresh developing or etching agent to prevent that the developer getting saturated.

The SAWATEC developers can be used for puddle or spray development, in which the optimum process being chosen based on application-technicaland economic criteria. The advantage of the spray development compared to the puddle development is that very small fine structures can be released. The benefit of the puddle method is that significantly less developer solution is needed and better results are achieved when the substrate has deeper structures.

SMD-200

SMD-300

SMD-600

SMD-900

Cleaning, developing or etching with high process performance

There are two different developer versions. The SMD-200 handles cleaning and development. The SMD-200-E handles etching in addition to cleaning and development. Both instruments are designed to process wafers up to 8“ (200 mm) or substrates up to 6 x 6“ (150 x 150 mm). The process chamber operates up to Ø 212 mm.

The SMD developers by SAWATEC are convincing due to their high process performance, low chemical consumption as well as reliable repeatability, even with thick photoresist layers. Due to the user-friendly operation and easy cleaning, these instruments are preferentially used in laboratories, R & D and small-scale production. The high-precision instruments are available both as mobile cabinet and bench-mounted unit.

FEATURES (BASIC CONFIGURATION)

 

  1. Up to 50 programmes with 24 segments each can be programmed
  2. Quick start function for repeat processes
  3. User-friendly process configuration with touch screen
  4. Process param.: spin speed, segment time, speed and height of the spray arm
  5. Electrical driven spray arm, with dynamic and static function
  6. Developer line and media tank (2 litre) for one developer included
  7. DI-water-rinse and N2 drying on the spray arm
  8. Nozzles in the process bowl for the backside rinse
  9. Control elements for dosing of the compressed air, N2 and vacuum
  10. Rotational direction can be selected (CW, CCW)
  11. Manual loading and unloading of the substrates
  12. Mechanical substrate fixation
  13. Acoustic signal after the end of the process

ADDITIONAL FUNCTIONS (OPTIONS)

 

  1. Additional developer lines (up to 4 developer lines possible)
  2. Separation unit for media exhaust (tank and facility)
  3. Media inline heating system
  4. Spray nozzle made of PEEK or stainless steel (0,3 / 0,5 mm)
  5. Nozzle for puddle developing made of PEEK or stainless steel
  6. Various sizes of Spin Chucks are available
PERFORMANCE DATA
  • Speed range: 0 to 3’000 rpm +/-1 rpm 1)
  • Speed acceleration: 0 to 3’000 rpm in 0.3 seconds 1)
  • Process time up to 4320 seconds
  • Speed of the spray arm 10 to 100 mm/second
  • Rinse and N2 drying 180 seconds/segment
  • Heatable process hood up to 50 °C
  • Spray nozzle made of PEEK (SMD-200) or stainless steel (SMD-200-E): 0.8 mm
1) Slower speed and acceleration for the process recommended

For more details or the documentation please contact our Sales Team via contact form

Cleaning, developing or etching with high process performance

There are two different developer versions. The SMD-300 handles cleaning and development. The SMD-300-E handles etching in addition to cleaning and development. Both instruments are designed to process wafers up to 12″” (300 mm) or substrates up to 8 x 8″” (200 x 200 mm). The process chamber operates up to Ø 312 mm.

The SMD developers by SAWATEC are convincing due to their high process performance, low chemical consumption as well as reliable repeatability, even with thick photoresist layers. Due to the user-friendly operation and easy cleaning, these instruments are preferentially used in laboratories, R & D and small-scale production. The high-precision instruments are available as mobile cabinet and bench-mounted unit.

FEATURES (BASIC CONFIGURATION)

 

  1. Up to 50 programmes with 24 segments each can be programmed
  2. Quick start function for repeat processes
  3. User-friendly process configuration with touch screen
  4. Process param.: spin speed, segment time, speed and height of the spray arm
  5. Electrical driven spray arm, with dynamic and static function
  6. Developer line and media tank (2 litre) for one developer included
  7. DI-water-rinse and N2 drying on the spray arm
  8. Nozzles in the process bowl for the backside rinse
  9. Control elements for dosing of the compressed air, N2 and vacuum
  10. Rotational direction can be selected (CW, CCW)
  11. Manual loading and unloading of the substrates
  12. Mechanical substrate fixation
  13. Acoustic signal after the end of the process

ADDITIONAL FUNCTIONS (OPTIONS)

 

  1. Additional developer lines (up to 4 developer lines possible)
  2. Separation unit for media exhaust (tank and facility)
  3. Media inline heating system
  4. Spray nozzle made of PEEK or stainless steel (0,3 / 0,5 mm)
  5. Nozzle for puddle developing made of PEEK or stainless steel
  6. Various sizes of Spin Chucks are available

PERFORMANCE DATA

  • Speed range: 0 to 3’000 rpm +/-1 rpm 1)
  • Speed acceleration: 0 to 3’000 rpm in 0.3 seconds 1)
  • Process time up to 2376 seconds
  • Speed of the spray arm 10 to 100 mm/second
  • Rinse and N2 drying 180 seconds/segment
  • Heatable process hood up to 50 °C
  • Spray nozzle made of PEEK (SMD-300) or stainless steel (SMD-300-E): 0.8 mm

1) Slower speed and acceleration for the process recommended

For more details or the documentation please contact our Sales Team via contact form

Developer SMD-600

The SMD-600 developer is specifically designed for cleaning and developing substrates with dimensions of up to 400 x 400 mm. The process chamber of the SMD-600 can accommodate substrates with a diameter of up to 600 mm, providing ample space for the development process.

FEATURES (BASIC CONFIGURATION)

 

  1. Up to 50 programmes with 24 segments each can be programmed
  2. Quick start function for repeat processes
  3. User-friendly process configuration with touch screen panel
  4. Process parameter: speed, acceleration, process time, speed of the spray arm, developing spray time
  5. Electrical driven spray arm, with dynamic or static function
  6. Developer line and media tank for one developer included
  7. Nozzle for DI-water-rinse and N2 drying on the spray arm
  8. Control elements for dosing of the compressed air and vacuum
  9. Rotational direction can be selected (CW, CCW)
  10. Manual loading and unloading of the substrates
  11. Mechanical substrate fixation
  12. Acoustic signal when the process has finished

ADDITIONAL FUNCTIONS (OPTIONS)

 

  1. Additional developer lines (up to 4 developer lines possible)
  2. Start/stop foot switch for ease of operation (cable length 1.8 m)
  3. Separation unit for media exhaust (tank and laboratory equipment)
  4. Developer tank heating system (2 litre)
  5. Spray nozzle made of PEEK (0,3 / 0,5 mm)

PERFORMANCE DATA

  • Speed range: 0 to 2’000 rpm +/-1 rpm 1)
  • Speed acceleration: 0 to 5’000 rpm in 0.5 seconds 1)
  • Process time up to 2376 seconds
  • Developer spray time 99 seconds/segment
  • Speed of the spray arm 10 to 200 mm/second
  • Rinse and N2 drying 99 seconds/segment
  • Spray nozzle made from PEEK 0,8mm

For more details or the documentation please contact our Sales Team via contact form

Developer SMD-600

The developer SMD-900 is designed to clean and to develop substrates up to Ø 900 mm or 600 x 600mm (24 × 24″), maximum substrate weight 10 kg.

FEATURES (BASIC CONFIGURATION)

 

  1. Up to 50 programmes with 24 segments, each can be programmed
  2. Quick start/stop function for repeat processes
  3. User-friendly process configuration with touch screen panel
  4. Process parameter: speed, acceleration, process time, speed of the spray arm
  5. Electrical driven spray arm, with dynamic or static function
  6. Developer line and media tank for one developer included
  7. Nozzle for DI-water-rinse and N2 drying on the spray arm
  8. Two nozzles in the process bowl for backside rinse
  9. Rotational direction can be selected (CW, CCW)
  10. Manual loading and unloading of the substrates
  11. Substrate fixation with vacuum ring, mechanical centering
  12. Acoustic signal when the process has finished

ADDITIONAL FUNCTIONS (OPTIONS)

 

  1. Additional developer lines (up to 3 developer lines possible)
  2. Start/stop foot switch for ease of operation (cable
    length 1.8 m)
  3. Developer tank heating system (2 litre)
  4. Spray nozzle made of PEEK (0,3 / 0,5 mm)

PERFORMANCE DATA

  • Speed range: 0 to 2’000 rpm +/-1 rpm 1)
  • Speed acceleration: max. 300 rad/s” (unloaded)
  • Process time up to 4’320 seconds with 0,1 sec. steps
  • Speed of the spray arm 0 to 200 mm/second
  • Spray nozzle made from PEEK 0,8 mm

1) Slower speed and acceleration for heavy substrates recommended

For more details or the documentation please contact our Sales Team via contact form

SRD Series: Absolute Purity

The SAWATEC spin rinser dryers are equipped with closed stainless steel process chambers and integrated imbalance compensation. The SRD-series is characterized by its excellent process quality and high productivity.

SRD-150-4S

Excellent process quality coupled with high productivity

The Spin Rinser Dryer SRD-150-4S is easy to operate and to handle. With this cooling and drying centrifuge, wafers or substrates can be cleaned following wet-chemical processes and dried efficiently with the aid of centrifugal force and heated nitrogen.

The process chamber respectively the cassette rotor is designed for a substrate diameter of 150mm, with a maximum load capacity of 4 wafer cassettes, each containing 25 wafers. The innovative cassette holder makes it easy to change three different cassette sizes without any tools.

These instruments are available as mobile cabinet unit and as an integral part of wet-chemical systems.

FEATURES (BASIC CONFIGURATION)

 

  1. Up to 50 programmes with 24 segments each can be programmed
  2. Quick start function for repeat processes
  3. User-friendly process configuration with touch screen
  4. Process parameters: Rotation speed, rinsing and drying time, rinsing and drying temperature, process chamber temperature
  5. Mechanical cassette fixing with lateral cassette support
  6. Pneumatically driven lid with two-hand operation
  7. Automatic balancing up to max. 100 gr. imbalance
  8. Manual loading and unloading of substrates
  9. Acoustic and visual signal at the end of the process

ADDITIONAL FUNCTIONS (OPTIONS)

 

  1. Customised cassette sizes
  2. Customised rotor for mask processes

PERFORMANCE DATA
  • Loading capacity: Max. 100 wafers (4 wafer cassettes each with 25 slots)
  • Cassette sizes from 4“ to 6“
  • Speed range: 0 to 1‘500 rpm +/-1 rpm
  • Rinsing time: 99 seconds/segment
  • Drying time N2: 99 seconds/segment
  • Rinsing and drying temperature: up to 100°C
  • Process chamber temperature: up to 70°C

For more details or the documentation please contact our Sales Team via contact form