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Categories: Hotplates, Lithography, Sawatec Instruments
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Ultra-high precision soft and hard baking
The Hotplate HP-200-Z was developed for ultra-high precise soft bake and hard bake processes in lithography, in MEMS and similar applications. The temperature range is designed for up to 300 °C by default. The set temperature and the temperature profile have narrow margins, meaning that a high coating quality can be achieved.
The multi-zone heating system ensures very high temperature distribution, which is adjustable for each zone. The hotplate also has a vacuum chamber and can be used as standard for bonding agent applications.
The ultra-high precision instruments are available as mobile cabinet and bench-mounted unit.


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