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Vendor: SAWATEC AG

Hotplate HP-200-Z

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Ultra-high precision soft and hard baking

The Hotplate HP-200-Z was developed for ultra-high precise soft bake and hard bake processes in lithography, in MEMS and similar applications. The temperature range is designed for up to 300 °C by default. The set temperature and the temperature profile have narrow margins, meaning that a high coating quality can be achieved.

The multi-zone heating system ensures very high temperature distribution, which is adjustable for each zone. The hotplate also has a vacuum chamber and can be used as standard for bonding agent applications.

The ultra-high precision instruments are available as mobile cabinet and bench-mounted unit.
Authenticity Icon 100% Original and Quality
Guarantee Icon 24 Months Guarantee

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