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Vendor: Ezzy Vision

Hotplate HP-200

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High precision soft and hard baking

The Hotplate HP-200 was developed for precise soft bake and hard bake processes in lithography, in MEMS and similar applications. It can be used for substrates with a diameter of up to 200 mm and thicknesses of 14 mm at maximum (proximity/loading pins in the upper start position). The temperature range is designed for up to 250 °C by default. The set temperature and the temperature profile have narrow margins, meaning that a high coating quality can be achieved.

The high-precision instruments are available as mobile cabinet, portable bench-top and bench-mounted unit.
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