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Categories: Combined Systems, Lithography, Sawatec Systems
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The SAWATEC combined system SM-200/HP-200 duo connects a Spin Module with a hotplate in one compact cabinet.
The Spin Modules SM-200 are the optimal choice for semi-automatic coating of thin layers. The Round-Closed Chamber Technology (RCCT) system effectively reduces air turbulence over the rotating substrate and improves coating uniformity by saturating the atmosphere with solvents faster in the closed chamber. This results in slower drying of the photoresist and a more homogeneous coating process with remarkable savings in consumed media.
The Hotplate HP-200 was developed for precise soft bake and hard bake processes in lithography, in MEMS and similar applications. The temperature range is designed for up to 250 °C by default. The set temperature and the temperature profile have narrow margins, meaning that a high coating quality can be achieved. The HP series is convincing due to its high level of uniformity and the high-precision process repeatability. It can be used for substrates with a diameter of up to 200 mm and thicknesses of 14 mm at maximum (proximity/loading pins in the upper start position).


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